The CONEC SlimCon series is a very compact version of the IP67 D-SUB connectors. The special feature is a small, one-piece die-cast zinc housing.

The connectors are designed for rear panel mounting and are in mechanical contact with the surrounding sealing surface of the panel. Sealing to the housing is achieved by a black seal. The circumferential sealing surface ensures that an even contact pressure is always exerted on the seal. This prevents overpressurisation of the seal and ensures secure installation and uniform sealing during operation.

The housing cut-out of the CONEC SlimCon series corresponds to that of other IP20 D-SUB connectors, so that no new cut-outs are required and a conversion from standard IP20 systems to the IP67 system of the CONEC SlimCon series is possible. The one-piece die-cast zinc housing makes the new CONEC SlimCon D-SUB connectors - similar to the CONEC Solid Body series - a mechanically extremely robust interface with reliable IP67 protection. However, the design reduces the occupied surface area by 48% to 52% compared to a standard IP67-protected D-SUB connector.

The CONEC SlimCon series is available in housing sizes 1-3 with the standard pole numbers 9-, 15-, 25-pol as well as the high-density pole numbers 15-, 26- and 44-pol. The 2W2C, 5W5 and 7W2 layouts are available as combination connectors. Other housing sizes and pin counts are available on request.

In addition to the variant for rear panel installation, a variant with an open threaded insert is also available. This variant offers the option of overmoulding by the customer and thus an overmoulded cable version with IP67 sealing. A matching press-off screw is also available.

Overall, the CONEC SlimCon series is ideal for industrial and harsh environments thanks to its small design and one-piece die-cast zinc housing.

Advantages

• Small installation space
• Low weight
• A non-waterproof interface can simply be replaced by CONEC SlimCon and is then waterproof
• Designed for harsh environments
• Shock and vibration-resistant in accordance with IEC60807-2
• Suitable for subsequent overmoulding (solder cup)

Application areas

• Agricultural technology
• Drive technology
• Automation technology
• Railway technology
• Communication technology
• Aviation
• Medical technology
• Military
• Transport industry